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Description
Characteristics
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Description
Summary
The Heltec QuickLink Series element includes a wide variety of sensors and actuators. With a unified packaging size and interface, the stamp hole allows it to be directly soldered onto your board like most modules, also it can be optionally equipped with a PH2.0 x 4 interface to make it compatible with the Grove Socket.
DA217 sensor is ultra-low power high performance capacitive three-axis linear accelerometer developed by micro-machined technology. The sensor element is fabricated by single crystal silicon with DRIE process and is protected by hermetically sealed silicon cap from the environment.
Main Features
- With unified packaging, stamp hole packaging (LGA) that can be directly soldered onto the circuit.
- Compatible with Grove socket through the PH2.0 x 4 interface.
- RoHS compliant
Specifications
| Parameters | Description |
|---|---|
| Supply Voltage | 2.5V |
| Typical Current | 95μA |
| Storage Temperature Range | -45~125℃ |
| Interfaces | I2C on PH2.0 x 4 I2C and SPI on LGA (2.54 stamp home) |
| Dimension | 15mm*15mm*10mm(including Quick Link Socket) 15mm*15mm*2mm(excluding Quick Link Socket) |
| Operating Temperature Range | -40~85℃ |
Description
Dimension
FAQ
The sensor can be seamlessly integrated with the Sensor Hub Series by simply plugging it into the board. This straightforward process allows for effortless connectivity and ease of use, allowing for precise data collection and analysis.
The Sensor Hub Series is a set of devices that are designed to collect and process data from various sensors. It is important to note that most of the Sensor Hub Series is supported, although some may have specific requirements as indicated. This means that users can expect reliable and high-quality performance from the majority of the devices in this series. However, it is recommended that users consult the manufacturer’s documentation to ensure compatibility with their specific needs. By doing so, users can maximize the functionality of the devices and ensure that they are able to meet their data processing requirements.
The sensor in question is not equipped with water and dust-resistant properties. In order to attain such capabilities, it would be necessary to employ the sensor within the protective enclosure of our Sensor Hub Products.
Packing list
The default packing list without selecting any accessories is as follows:
| Item | Quantity |
|---|---|
| 3-axis Acceleration(Dip Angle) Sensor | x1 |
Characteristics
| Weight | 3 g |
|---|---|
| Dimensions | 1.6 × 1.6 × 0.9 cm |
| Need PH2.0 x 4 Socket? | Yes, No |
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3-axis Acceleration(Dip Angle) Sensor(DA217)
What's this?
The 3-axis Acceleration(Dip Angle) Sensor based on the DA217 chip, belongs to the Heltec Quick Link Series. The module has stamp hole packaging (LGA) that can be directly soldered onto the circuit, or compatible with the Grove socket through the PH2.0 x 4 interface.
Original price was: $9.90.$6.50Current price is: $6.50.
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