Wireless Shell(V3)

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Description

Characteristics

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Description

Summary

HTIT-Wsh(Wireless shell) is a long communication range, high receive sensitivity, low power consumption(9uA) and low cost LoRa node module. The HTIT-Wsh is composed up of an MCU (ESP32-S3FN8) and Semtech LoRa Transceivers (SX1262). 38.4 x 16.1 x 3.2(mm) size with 1.27mm stamp holes package makes it can be assembled into your PCB or products directly.
HTIT-Wsh is provide Wi-Fi, BLE and LoRa solution, perfectly support Arduino®. Users can easily carry out secondary development and application.

Compared to Wireless Shell (V2), V3 has made the following upgrades:

Item	Wireless Shell (V2)	Wireless Shell (V3)
MCU	ESP32-D0	ESP32-S3
LoRa Node Chip	SX1276	SX1262
USB Socket	Micro USB	USB Type C
Crystal Oscillator	Ordinary crystal oscillator	High precision temperature compensated crystal oscillator
Low Power Features in Deep Sleep	30uA	<10uA
Other Update		Better impedance matching of RF circuits.

Main Features

CE Certificate;
Microprocessor:ESP32-S3FN8 (Xtensa ® 32-bit LX7 dual core processor, five stage pipeline rack Structure, main frequency up to 240 MHz), with LoRa node chip SX1262;
RF shielding (contain a shield shell) and other protection measures;
Integrated WiFi, LoRa, Bluetooth network connections, both of them are IPEX socket;
Support the Arduino development environment;
(Exclusive) Supports the Arduino version of the ESP32 + LoRaWAN protocol routine provided by Heltec. This is a standard LoRaWAN protocol that can communicate with any gateway/base station running the LoRaWAN protocol (requires serial number activation, only the development of the company) The board is available, the serial number can be queried onthis page);
With good RF circuit design and basic low-power design (sleep current: 9uA theoretically), it is convenient for IoT application vendors to quickly verify solutions and deploy applications.

Specifications

Parameters	Description
Master Chip	ESP32-S3FN8 (Xtensa®32-bit lx7 dual core processor)
LoRa Node Chip	SX1262
Frequency	470~510MHz, 863~928MHz
Max. TX Power	21±1dBm
Max. Receiving Sensitivity	-139dBm
Wi-Fi	802.11 b/g/n, up to 150Mbps
Bluetooth LE	Bluetooth 5, Bluetooth mesh
Hardware Resource	7ADC1 + 8ADC2; 9Touch; 3UART; 2I2C; 2SPI; etc.
Interface	LoRa ANT(IPEX1.0); 2.4G ANT (IPEX1.0); 1.27 spacing Stamp hole.
Operating Temperature	-40 ~ 85 ℃
Dimensions	38.4 * 16.1* 2.8 mm

Description

Pin Map

High light

Arduino-Compatible

We have done a lot of migration and development, made it perfectly support Arduino^®, can run the LoRaWAN protocol stably.

Stamp edge design

1.27 stamp edge design, can be directly integrated into the application circuit

Docs & Resource

[Resource] — Heltec ESP(ESP32&ESP8266) framework
[Resource] —Heltec ESP32 special Lib
[Resource] —Datasheet
[Resource] —Schematic_Diagram
[Resource] — Reference_Design
[Attachment] — Heltec LoRaWAN test server based on TTS V3

Packing list

The default packing list without selecting any accessories is as follows:

Item	Quantity
Wireless Shell	x1

Characteristics

Weight	3 g
Dimensions	4 × 2 × 0.4 cm
LoRa Band	470~510MHz, 863~870MHz, 902~928MHz

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